JPH047094B2 - - Google Patents

Info

Publication number
JPH047094B2
JPH047094B2 JP57198570A JP19857082A JPH047094B2 JP H047094 B2 JPH047094 B2 JP H047094B2 JP 57198570 A JP57198570 A JP 57198570A JP 19857082 A JP19857082 A JP 19857082A JP H047094 B2 JPH047094 B2 JP H047094B2
Authority
JP
Japan
Prior art keywords
melting point
point metal
forming
high melting
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57198570A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5988868A (ja
Inventor
Hidekazu Okabayashi
Mitsutaka Morimoto
Eiji Nagasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP57198570A priority Critical patent/JPS5988868A/ja
Priority to US06/550,913 priority patent/US4558507A/en
Priority to DE8383111366T priority patent/DE3381880D1/de
Priority to EP83111366A priority patent/EP0109082B1/en
Publication of JPS5988868A publication Critical patent/JPS5988868A/ja
Publication of JPH047094B2 publication Critical patent/JPH047094B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H01L21/76889—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances by forming silicides of refractory metals

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
JP57198570A 1982-11-12 1982-11-12 半導体装置の製造方法 Granted JPS5988868A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP57198570A JPS5988868A (ja) 1982-11-12 1982-11-12 半導体装置の製造方法
US06/550,913 US4558507A (en) 1982-11-12 1983-11-10 Method of manufacturing semiconductor device
DE8383111366T DE3381880D1 (de) 1982-11-12 1983-11-14 Verfahren zur herstellung einer halbleiteranordnung mit einem diffusionsschritt.
EP83111366A EP0109082B1 (en) 1982-11-12 1983-11-14 Method of manufacturing a semiconductor device comprising a diffusion step

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57198570A JPS5988868A (ja) 1982-11-12 1982-11-12 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5988868A JPS5988868A (ja) 1984-05-22
JPH047094B2 true JPH047094B2 (en]) 1992-02-07

Family

ID=16393375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57198570A Granted JPS5988868A (ja) 1982-11-12 1982-11-12 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5988868A (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07120672B2 (ja) * 1986-01-28 1995-12-20 日本電気株式会社 半導体装置
JPH0685320B2 (ja) * 1989-10-31 1994-10-26 シャープ株式会社 電子機器の電池収納機構
JP2606954B2 (ja) * 1990-08-30 1997-05-07 シャープ株式会社 電池の収納構造

Also Published As

Publication number Publication date
JPS5988868A (ja) 1984-05-22

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